ICTM Collaborative R&D 2023

How to identify CMC grinding processes with reduced workpiece damage using machine-internal and external sensor signals?

Challenge and Motivation

• CMC peripheral zone damage is examined after grinding process. It is based on surface and subsurface analyses and involves high effort.
• That is why the design of a grinding process strategy ensuring reduced damage of CMC workpiece peripheral zone is often based on empirical knowledge.

Objective

• Determination of CMC grinding processes with reduced workpiece damage through data-driven process analysis of machine-internal and external sensor signals